Hello,

   I like to understand which test can demonstrate the risk of having
   a failure on board due to lead-bismuth-tin low melting phase.

   As the low melting phase is 98deg C , i wonder if failure can occur just
below : e.g. at 80 deg C or above.
   The joint solder average composition will be far from the ternary low melting
eutectic anyway.

  Today i think about a creep test with a component coated with Sn-5%Bi
soldered on board with SnPb paste and place on bottom side of a board
+ mechanical loading (hanging) , the whole being place in an oven at various
temperature.

 Please let me know if a better test exist.

  i like to thanks people contributing to this New Frontier project
(lead-free) challenging the electronic industry.

    Luc Petit ( [log in to unmask])

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