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February 2005

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Subject:
Re: Lead Free Material Composition
From:
"Kallin, Dan" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 24 Feb 2005 16:48:40 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (44 lines) 
It seems that each layer would be a homogenous material so that would be your point of compliance.
It is the lead you are worried about, so if close, you would need to calculate the amount of lead rather than PbO, however it seems this would not be a problem even if it was lead at the percentages given.  
This assumes the definitions and de minimus levels going back and forth get finalized.

That is my opinion only, which, with a couple of bucks, will get you a coffee.

Dan

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Scott Lefebvre
Sent: Thursday, February 24, 2005 3:45 PM
To: [log in to unmask]
Subject: [LF] Lead Free Material Composition


I received a material composition datasheet from a manufacturer and I was hoping if someone could review this pdf file.  I noticed for some it's component composition they are still using Lead Oxide.  If lead oxide is considered the same as Lead per ROHS then the permissible values given seem to be above .1% wt total.
 
Just in case the PDF doesn't go through I'll provide some of the details.
 
Coating layer:  Lead Oxide 0.87 wt%, Silicon dioxide 0.69 wt%, Boron Trioxide 9.34 wt%, Aluminum 0.18% and ...
 
Resistive Layer: Lead oxide 0.30 wt%, Silicon dioxide 0.11 wt % and ......
 
 
Scott Lefebvre
 
 

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