Pascal,

   I would be interested in reading your paper presented at the
IPC/JEDEC Pb-Fee Conference in San Jose.  Can you share that document
with me

Victor,

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Thursday, July 22, 2004 9:44 AM
To: [log in to unmask]
Subject: Re: [LF] LeadFree and Land Patterns (Wave solder)


Dear Bill,

Within Philips we have seen the necessity to change the solder pads for
wave soldering in some cases ad have made design rules. Some general
rules that we apply are stated below: -Enlarged solder spacing QFP end
solder thief pads
- Enlarged solder spacing multi row connectors
- Place multi pin components parallel to the solder transport direction
- Additional solder thief application
- No track/solder land connection, which reduces solder spacing

We reported about this at the IPC/JEDEC Pb-free conference in San Jose
in March this year together with our experiences of introducing Pb-free.
If you would like I can send a copy of this paper to you. We have also
worked with C-cut pads for similar problems and this seems to work.

With kind regards,

Pascal

------------------------------------------------------------------
Dr. ir. P. Oberndorff
Philips CFT, SAQp 233
Process Technology/ Electronic Packaging & Thin Film
P.O. Box 218
5600 MD Eindhoven
Tel: +31 (0)40 27 32223
fax: +31 (0)40 27 36815
e-mail: [log in to unmask]




                                                   To:
[log in to unmask]
                                                   cc:   (bcc: Pascal
Oberndorff/EHV/CFT/PHILIPS)
                                                   Subject:    Re: [LF]
LeadFree and Land Patterns (Wave solder)

               "William E. Hunt"                   Classification:
               <[log in to unmask]
               M>

               Sent by:
               Leadfree
               <[log in to unmask]>

               2004-07-21 10:21 PM
               Please respond to
               "(Leadfree Electronics
               Assembly Forum)"; Please
               respond to
               william.e.hunt






Has anyone seen changes for LF wave solder pad geometries? Our contract
mfg has requested pad changes for a component that is hand soldered
after the board passes through wave solder.  The pad was collecting too
much solder and filling the hole. Then the hole would need to be cleaned
out and the part hand soldered to the board. The change was to a C-cut
pad. The idea of a C-cut pad is to prevent solder from filling the hole
during wave soldering so the component can be easily inserted and hand
soldered post wave. Instead of having just one opening in the pad the CM
proposed openings on both sides (leading and trailing edges) of the pad.
This is a high volume, simple  type III assembly using a XPC laminate.
We are still investigating the need for this change and continue to test
but I'm interested in other experiences with LF wave soldering.

What are your experiences with LF wave solder?



Bill Hunt
Eastman Kodak
Office: 585-726-4892
Fax: 585-726-3278




Pratap Singh <[log in to unmask]>
Sent by: Leadfree <[log in to unmask]>
07/21/2004 03:13 PM
Please respond to "(Leadfree Electronics Assembly Forum)"; Please
respond to Pratap Singh


        To:     [log in to unmask]
        cc:
        Subject:        Re: [LF] LeadFree and Land Patterns


Roger,
No need to fret. Land pattern should not be affected by converting to LF
solder. Depending upon the solder used, reflow profile settings will
change since LF solders flow at higher temperature.. Visual inspection
and void inspection should also remain same.

_____________________
pratap singh
Tel./Fax: (512) 255-6820
email: [log in to unmask]
www.rampinc.com

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