Subject: | |
From: | |
Reply To: | Leadfree Electronics Assembly E-Mail Forum. |
Date: | Tue, 17 Aug 1999 16:31:58 EDT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi David & Rick,
Rick's answer to David's query is right on the money.
The other thing that needs to be added is that component baking to prevent
popcorning due to internal vapor pressure will be even more important than
now.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
################################################################
Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe: SUBSCRIBE Leadfree <your full name>
To unsubscribe: SIGNOFF Leadfree
################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.leadfree.org ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
################################################################
|
|
|