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| From: | |
| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Thu, 26 Feb 2004 15:27:35 -0000 |
| Content-Type: | text/plain |
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Yes there is an increase and yes its not common in Europe or the USA but
centre board supports are good practice for any wave soldering operation.
Designers should be using this technique on board designs in some cases it
can save a fortune in soldering pallets. Most board sag in pallets anyway.
Loved working in APEX again this year, just home and LA Airport was not a
zoo this year.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of MA/NY DDave
Sent: 23 February 2004 05:25
To: [log in to unmask]
Subject: Re: [LF] Question on lead-free wave solder processes
Hi Ken, and IPC LF Listservers,
With the increased contact time with the wave how do you manage the droop
of the PCB. Do you use fixtures or rails to support it? Do you notice any
more interlaminate fractures post wave solder.
YiEngr, MA/NY DDave
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