Hello everybody,

I have an interesting question today, here we go,



How much ‘lead’ is drained (or wasted or dumped or emitted or discharged) into the environment directly by a manufacturing facility that incorporates either of the following:

   While manufacturing solder paste
   While performing HASL process for PCB finish
   Wile finishing component leads with lead based finish
   While PCB assembly process (SMT or through hole)
      While washing PCBs (due to misprint or any other reason)
      While dumping paste (due to expiry date or any other reason)
      any other source




All I need is ‘How much lead (other than the lead in the solder joint) is wasted/dumped in the environment by an electronics manufacturing facility at the location of the facility?’



I would greatly appreciate if anybody can provide the actual data on any of these. I understand that it is very difficult to quantify it, but I am ready to take expert opinions also.



Thank you in advance

Sincerely,

Santhakumar



Santhakumar Rajesnayagham
Graduate Student & Research Assistant
Center for Electronics Manufacturing and Assembly (CEMA)
Rochester Institute of Technology, Rochester, New York
Phone : (CEMA Lab) 585-475-7293





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