Burn e-waste?! The value of the metals makes the economic decision-- old
PCBs to the smelter.  It's called recycling, and properly done, is safe.
Check OSHA refs.  Some laws make sense.

http://www.osha.gov/SLTC/etools/leadsmelter/environmentalcontrols/index.html
http://www.epa.gov/oar/urbanair/lead/index.html

--- John Burke <[log in to unmask]> wrote:

> Hi Guys,
> 
> Here is an alternate viewpoint on lead in solders sent to me though the
> site. Anyone want to educate Bill on the environmental aspects of this
> be my
> guest I have copied him on this email.
> 
> Bill  - nice Loctite ad - do you work for them??
> 
> John
> 
>  
>  
> John Burke
>  
> 
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]] 
> Sent: Wednesday, April 18, 2007 8:41 AM
> To: [log in to unmask]
> Subject: EasySiteWizard FORM (http://www.rohsusa.com/home.html)
> 
> 
> FullName = Bill Fretts
> 
> EmailFrom = [log in to unmask]
> 
> Subject = Call the Waaambulance!
> 
> MyComment = Buck up you whiners and start solving problems.
> 
>  > Lead has to get out of ewaste. Much of the world is burning it for
> energy
> reclamation / landfill diversion and the effects of the airborne lead
> needs
> to be a factor in the analysis. Local North American dumps are planning
> to
> burn now too. Balance the odd h/w failure with the survival of the
> species.
> 
> > Tin whiskers - are manageable but you need standards on lead finishes.
> Consumer JEDEC parts don't care about whiskers since their stuff is
> disposable or 5 year life. NT and others have very specific finish
> specifications for their components to disqualify whisker prone finishes
> -
> bright tin & Bi in particular. Those tin whisker horror stories get
> trotted
> out every few years.
> 
> > Hi Rel or Extreme Service SAC Reliability is pretty good. The joints
> are
> more brittle, but they're stronger too. If its for high mechanical shock
> service (automotive etc) look to the Locktite SAC solder flux /
> underfill,
> like peanutbutter for chocolate.
> 
> 
> Loctite® 3536 delivers improved reliability for today’s advanced CSP and
> BGA
> packages. The material is designed to quickly fill the space beneath the
> CSP
> and BGA packages and cures rapidly at low temperature, which minimizes
> thermal stress to other components on the PCB and allows for in-line
> curing
> to increase device throughput. When fully cured, Loctite 3536 delivers
> excellent protection for solder joints against mechanical stress such as
> shock, drop and vibration in hand-held devices and testing confirms its
> superiority over competitive materials when subjected to these stresses.
> In
> addition, testing of the material to JEDEC drop test standards on 0.4mm
> and
> 0.5mm Pb-free devices has shown that Loctite 3536 offers five times the
> reliability over non-underfilled Pb-free devices.
> 
> Xsubmit = Submit
> 
>  = 
> 
> ----------------------------------------
> [IP: 161.44.198.204]
> 
>
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