Dave

Thanks for the ref to Ray Prasad's article on copper migration.
You know that we can mitigate process-caused defects but laws of phjsics
are more difficult to repeal.

Harvey Miller

--- MA/NY DDave <[log in to unmask]> wrote:

> Hi Harvey, IPC LF Listservers,
>
> Thanks Harvey.
>
> I believe we are going to see a lot of these new defects as the roll out
> increases.
>
> Some will eventually be due to errors, and improvements and cross
> knowledge
> will route some out as we go down the reliability bath tub curve that
> happens for most new product introductions. And this bath tub curve is a
> BIG disruptive one that won't bottom out for quite some time.
>
> Another one similar to what you wrote on Silver was written up in
> October's
> SMT Magazine by Ray Prasad a member of the IPC-7095 BGA committee.
>
> http://smt.pennnet.com/Search/ShowIssue.cfm
>
> Part 1: BGA Ball Drop - A Concern in Lead-free Assemblies
>
> Where Cu is migrating up through the solder ball to the underside of the
> package and causing a beautiful shear effect (or Ball Drop) across the
> package bottom.
>
> Yours in Engineering, Dave
> YiEngr, MA/NY DDave
>  P.S. RIM-BevC's abbreviated article is a few pages later
>
>
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