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November 2006

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Subject:
From:
mickey weiner <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 30 Nov 2006 17:46:36 +0200
Content-Type:
text/plain
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text/plain (85 lines)
Yes, I haven't heard of it neither  before;  but as with everything in
LF, there are many surprises yet to come.


Mickey

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Gabriela Bogdan
Sent: Thursday, November 30, 2006 5:41 PM
To: [log in to unmask]
Subject: Re: black pad

That's news for me.
Gaby
----- Original Message -----
From: "Pete Houwen" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, November 30, 2006 6:31 PM
Subject: Re: [LF] black pad


> ENiG certainly seems to be having great difficulty in living down it's

> reputation.
>
> Recent developments in Phosphorus enrichment in the Nickel bath have
> gone a long way in decreasing occurances of black pad, close to
> eliminating it at quality fabrication shops.  Removing the lead from
> BGA balls has given us one advantage, in that it keeps the Nickel
> migration from continuing after the initial intermettalic is formed,
> reducing process induced black pad.
>
> 7 years is ancient history for ENiG.
>
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To unsubscribe, send a message to [log in to unmask] with following text in
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To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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