Wish I had invested in the tin market way back when...
Phil
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Thursday, January 21, 2010 8:36 AM
To: [log in to unmask]
Subject: Re: [LF] Fodder for Discussion?
One thing is a fact, just ten years ago tin was around $5,000 a tonne, then
started a meteoric climb around 2005 and peaked to almost $26,000 just
before the global recession.
It then dropped to around $11,000 a tonne at the beginning of the recession
but has started its climb once again. It's now at around $18,000 a tonne.
Somebody is making some real money from lead-free...
Steve
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of James, Chris
Sent: Thursday, January 21, 2010 6:10 AM
To: [log in to unmask]
Subject: Re: [LF] Fodder for Discussion?
I'm not going to argue the pro's and con's but I don't think you can
call lead free solder sub standard any more than you can call lead free
petrol substandard.
If you use/apply either "incorrectly" you will end up with a problem.
IMO if the Xbox had been designed correctly and assembled correctly then
the problems would not have arisen. Many companies are successfully
manufacturing a wide range of technologies using lead free solder.
Who is to say that even if the Xbox used sn/pb solder it still would not
have suffered from a thermal management issue. The product gets used in
a wide range of ambient temperatures, compounded by varying enclosures
and levels of cleanliness, so thermal management needs the utmost
consideration.
Leadfree is here, the global markets requiring it outstrip those that
still don't but the momentum is still gathering, so anyone still with a
small minded jaundiced opinion on it needs to step back and take a
reality check and move on.
Chris
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Marcus L. Thompson
Sent: 20 January 2010 17:39
To: [log in to unmask]
Subject: Re: [LF] Fodder for Discussion?
Points well made, Nigel, particularly in consideration of the apparent
intellectual capacity of ranking Microsoft personnel: I have no doubt
that the selected Chinese manufacturing entity (my assumption, as I've
never even seen one of the units myself) was "carefully" chosen to
fulfill the "target objectives" set forth by corporate management.
The funniest thing about this particular case (again, I might be wrong
here) is the fact that lead-free was chosen to produce the device well
before EU import requirements were put into effect. So, one could
assume that a hamstrung and crunched design department probably missed
the thermomechanical mark for the application; and created a product
which would have performed satisfactorily if it had not been constructed
with what amounts to substandard solder...
Case closed?
--- Previous Message in This Thread ---
Subject: Re:[LF] Fodder for Discussion?
From: Nigel Burtt <[log in to unmask]>
To: [log in to unmask]
Date: Wednesday, January 20, 2010 2:20:55 AM
> I was going to say much the same thing as Jean-Paul (only less
eloquently)
> having read the first few posts There are two obvious possible causes
here:
>
> (1) the use of lead-free solder
> (2) poor design for reliability, failing to account for
thermo-mechanical aspects
>
> Given this is a first mass-produced product for Microsoft (a computer
software
> company with no track-record in similar hardware on the world market)
I know
> which one I would be more inclined to point the finger at. The other
is
> probably a contributing factor, at least in as far as a full and
proper
> understanding of its performance and the manufacturing process
controls
> necessary to guarantee the required level of performance for the
design.
>
> Nigel Burtt
> Enjaybee Associates
> www.nigelburtt.co.uk
>
>
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