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November 2000

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Subject:
Re: Standard Method for Solderability Testing
From:
Charlie Dearborn <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Wed, 1 Nov 2000 16:01:46 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (47 lines) 
Gordon,
    Are the temperature listed in J-STD-002 going to be raised to reflect the higher
temperatures for lead-free? If so what will they be raised to? Also a while back I saw a
revision to the JESD22A113B (Preconditioning of Nonhermetic Surface Mount Devices Prior to
Reliability Testing) in sign-off to reflect a change which requires complete solder immersion
of devices instead of using a reflow oven. Do you know the status of this Standard? And the
expected impact on Moisture Level Classification?

Regards,
Charlie Dearborn
Fairchild Semiconductor
QA/Reliability

"Davy, Gordon" wrote:

> Clark:
>
> In response to your inquiry, the industry standard solderability test method
> is J-STD-002. The task group chairmen for maintaining this spec are Dave
> Hillman (for IPC), [log in to unmask],  (319) 295-1615, and Mark
> Kwoka (for EIA), [log in to unmask], (321) 729-5790. There was extensive
> discussion of lead-free solderability testing at Works 2000.
>
> Gordon Davy
> Northrop Grumman ESSS
> Baltimore, MD
> [log in to unmask]
> 410-993-7399
>
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information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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