Pascal,
I'll E-mail you as soon as I find the paper(s) that talked about tin
whiskers growing from solder joints, even though parts had been annealed
after tin plating.  But I don't know just when that will be, because it
(they) are *somewhere* in the 12 feet (3.6m) of papers that I have
accumulated on lead-free electronics, RoHS, and WEEE since December
2004.  So far I only have them organized into folders based on the first
letter of the first author's last name, or by the first letter of the
title for anonymous items.

I downloaded/photocopied well over 100 more papers this weekend, driving
over 390 miles to "hit" Ohio State University's Science and Engineering
Library for the 4th time this year.

Thanks!
                                                John Barnes

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