Jack,
I appreciate your response and all of the others who have commented on this
subject.
We are currently surveying our vendors regarding the lead-free initiative
and have asked for 260 deg. C. We are glad we may not have to change the
temperature requirement later. So far, no vendors have disagreed with 260
deg. C but the actual responses vary in quality. I had one small vendor ask
what the higher temperature requirement was for, after all, their parts are
lead-free already. The impact is still spreading.
Thanks and best regards,
Doug
-----Original Message-----
From: Jack Crawford [mailto:[log in to unmask]]
Sent: Thursday, August 07, 2003 12:48 PM
To: [log in to unmask]
Subject: Re: [LF] Component Maximum Reflow Temperature Requirement
The joint IPC and JEDEC working group is on a fast-track to publish
Amendment 1 to J-STD-020B to change the high temp to 260 deg C. The next
meeting will be August 26-27, 2003 at Sonoscan Facility in Elk Grove
Village, IL.
Contact me off-net if you need additional meeting information.
Cordially,
Jack
Jack Crawford
Director, Certification and Assembly Technology
[log in to unmask]
847-790-5393
fax 847-504-2393
-----Original Message-----
From: Gilbert, Doug [ <mailto:[log in to unmask]>
mailto:[log in to unmask]]
Sent: Thursday, August 07, 2003 9:52 AM
To: [log in to unmask]
Subject: [LF] Component Maximum Reflow Temperature Requirement
All,
During our study of the lead-free electronic assembly process as it relates
to component requirements, the maximum temperature seems varies from 245
deg. C to 260 deg. C. The IPC/JEDEC J-STD-020B specification says: Peak
temperature for small SMD devices (package volume < 350mm*3) is 250'C Peak
temperature for large SMD devices (package volume > 350mm*3) is 245'C.
Other papers, such as the EMS Forum "Guidelines for Suppliers Transitioning
to Lead-Free Components" and papers from EMS ( Flextronics and Celestica,
for example ) talk about 260 deg. C maximum reflow temperature for
components is required.
Should we ask component manufacturers to qualify their components per JEDEC
standard or 260 deg. C? Also, wavesolder pot temperature seems to be around
270 deg. C so what maximum temperature do components typically rise to?
Thanks,
Doug
------------------------------
Doug Gilbert
EEDU Component Engineering
Xerox Corporation M/S ESAE-221
701 S. Aviation Blvd.
El Segundo, CA 90245
Phone (310) 333-7702 Fax (310) 333-6872
Xerox Intelnet 8 * 823-7702
mailto:[log in to unmask]
<mailto:[log in to unmask]>
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