The link to Kelley and Bergum's article is here: http://pcdandm.com/cms/content/view/3054/95/
(One minor aside: That would be Printed Circuit Design & Manufacture magazine.)
Mike
Mike Buetow
Editor in Chief
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>>> [log in to unmask] 12/22/06 9:58 AM >>>
Hi Ioan,
cT2xx stands for 'cyclic time-to-delamination at 2xx°C'.
It is not an 'official' test, yet, but the evidence for its need is
clearly building in this direction (see the Ed Kelley and Erik Bergum
article in the Nov & Dec issues of Printed Circuit magazine).
In my White Paper I describe it as: "A cyclic 'time-to-delamination'
protocol has been proposed to perhaps be in addition to or as a
replacement of T288 generating a cT288-value. This value would be
generated my thermally cycling to 288°C x-number of times, e.g., 6 to
simulate 3 reflow and 3 rework cycles, and then holding at 288°C to
delamination. It has been reported that some 'high performance' resin
systems degrade with thermal cycling to 260°C much more readily than
from a single thermal excursion to 260°C.
Werner
-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Sent: Fri, 22 Dec 2006 9:12 AM
Subject: Re: [LF] STII
Hi Werner,
what is cT2xx and where can I find the details?
Thanks,
Ioan
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Thursday, December 21, 2006 7:03 AM
To: [log in to unmask]
Subject: Re: [LF] STII
Hi Rex,
I have applied the STII to the data given in the recent article in the
Nov &
Dec issues of Printed Circuit magazine by Ed Kelley and Erik Bergum,
and it
fits perfectly.
Please understand, that the properties the STII includes do not give any
indication of the tendency of cohesive failure [I think that is what
you are
referring to] the the filled resin resulting from some fillers.
Nothing is perfect. That is why I am recommending testing not just with
T260/T288, but with cT260/cT288.
Werner
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