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| From: | |
| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Tue, 9 Dec 2008 04:16:13 -0500 |
| Content-Type: | text/plain |
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Joseph,
Your kind to dig out the link is appreciated, I am interested in detail.
Thanks.
Regards / Peter Deng
D +86(0)755 2671 0624
M ( +86) 138 2876 8267
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: 2008Äê12ÔÂ9ÈÕ 4:45
To: [log in to unmask]
Subject: [LF] vibration testing of tin-lead and lead-free solder joints
Greetings folks
Found this on the wires today... (Cut it earlier out but lost the link but I
am sure I am not the only one who read it. However I can go dig it up if
there is interest)
Why are we still using lead-free solder again? So it goes....
Joe
"Davide de Maio of National Physical Laboratory discussed the high frequency
vibration testing of tin-lead and lead-free solder joints, with reference to
automotive and aerospace electronics--a grim reminder that 80% of failures
in airborne electronics were attributable to vibration and shock. A test piece
had been designed representing a single solder joint between two copper
components, which was tested to failure at frequencies of 400Hz and 800Hz. A
range of SAC lead-free solders had been evaluated, with tin-lead as a comparison.
The tin-lead solder outperformed the lead-free examples, especially at the
higher frequency. In general, failure occurred at or near the intermetallic
interface, which would be expected to be the most stressed area. Of the SAC
alloys, performance at 400Hz was better the higher the silver content. Annealing
of SAC had a deleterious effect on performance at both 400Hz and 800Hz."
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