Wouldn't that be a story:

"A team of Antarctic researchers investigating effects of electronics
manufacturing on the ozone layer were stranded today when their GPS system
malfunctioned. The malfunction is thought to be associated with the removal
of lead from the solder"..................8-)

John

-----Original Message-----
From: MA/NY DDave [mailto:[log in to unmask]]
Sent: Friday, July 02, 2004 9:37 AM
To: [log in to unmask]
Subject: Re: [LF] tin pest


Hi Jim, Tyco-Bob, Jean-Paul, and IPC LF Listservers,

<Thank you for your response.  Like many other issues in this Lead-Free
transition, it sounds as if "tin pest" has been overblown.>

I am not sure YET that the issue is overblown. I believe that based on the
environments of certain products or certain product life conditions that we
may see this selectively in real life applications. In June Tin's KayN
(Soldertec) did respond to us that ITRI has not seen any effect and
privately others have also written to me that they have yet to see any
effect.

My first guess is product that has to survive continual cold temperatures
like in the Artic or in refrigerator/freezers where -40C/-40F is common or
in other applications like thermoelectric coolers.

As for a nucleation site for the transformation to get started, I am less
clear of how that all happens. More Study, or the Luck of being an IPC LF
Listserver is needed.

If you look at the UK's Open University Report it seems obvious that we
will see this under certain conditions. The sample just had too too much
Tin Pest to be a coincidence.


Yours in Engineering, Dave
Y i Engr, MA/NY DDave

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