Could I get some direction on some of the board surface finishes the
designers have gone to in order to get away from the HASL process which
contains lead. Also any explanation of problems or issues with whatever
you are using would be helpful.

 

Thanks

Doug


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Danielle Casha
Sent: Wednesday, July 21, 2004 3:21 PM
To: [log in to unmask]
Subject: Re: [LF] LeadFree and Land Patterns

Land patterns don't need to change - but the apertures on the stencil
may
need enlarging.  Typically, LF paste doesn't wet as well as Pb pastes.

Regards,
Danielle


Danielle L. Casha
Process Technician
EPM
Tel: 905-479-6203  ext. 272
Fax: 905-479-6990
Website: www.epmnet.com

-----Original Message-----
From:   Pratap Singh [SMTP:[log in to unmask]]
Sent:   Wednesday, July 21, 2004 3:14 PM
To:     [log in to unmask]
Subject:        Re: [LF] LeadFree and Land Patterns

Roger,
No need to fret. Land pattern should not be affected by converting to LF
solder. Depending upon the solder used, reflow profile settings will
change since LF solders flow at higher temperature.. Visual inspection
and void inspection should also remain same.

_____________________
pratap singh
Tel./Fax: (512) 255-6820
email: [log in to unmask]
www.rampinc.com

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