LEADFREE Archives

July 2001

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Subject:
From:
"LW Foo (A_Engineering)" <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Fri, 20 Jul 2001 09:07:38 +0800
Content-Type:
text/plain
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text/plain (67 lines)
Hi Richard,
What is OSP stand for??
Thanks & Regards
L.W.Foo
Engineer - Advanced Technology
Foo Loke Whong
Carsem Semiconductor Sdn Bhd
Email id : [log in to unmask]
Phone : + (6 05) 5262333       Ext :530
Fax : + (6 05) 5265333

> ----------
> From:         Richard Loew[SMTP:[log in to unmask]]
> Reply To:     Leadfree Electronics Assembly E-Mail Forum.;[log in to unmask]
> Sent:         Tuesday, July 17, 2001 11:57 PM
> To:   [log in to unmask]
> Subject:      [LF] Solderability test procedure for OSP
>
> Dear all,
>
> does anybody know an equivalent test procedure for OSP pcbs ?
> HAL: temperature storage at 155?C for 16 hours => soldering => visual
> inspection.
> OSP: ???
>
> Thanks for your kindly help.
>
>
> Mit freundlichen Gruessen / Best regards
>
> Richard Loew
>
> Component Engineering
> OSRAM GmbH
> Ohmstrasse 50
> D-83301 Traunreut
> Ph.:    +49-(0)8669 / 33-828
> Fax:        +49-(0)8669 / 33-356
> e-Mail: [log in to unmask]
>
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