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April 2005

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 29 Apr 2005 08:17:53 -0700
Content-Type:
text/plain
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text/plain (57 lines)
Well - my only excuse is it's Friday,

Follow the link..............To see the E-waste mountain man

John

http://news.bbc.co.uk/1/hi/magazine/4490211.stm

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of MA/NY DDave
Sent: Thursday, April 28, 2005 7:49 PM
To: [log in to unmask]
Subject: Re: [LF] SnBi parts in SnPb paste


Hi Bill, IPC LF Listservers,

In addition to checking the IPC archives, and two of the books that UK
Bobbie Willis and I discussed awhile ago that have some of this information
supposedly a report by our gal buddy Kay Nimmo, B.P. Richards, et al covers
Bi in consumer products. Go into the tin technology web site and look
for "An Analysis of the Current Status of Lead-Free Soldering". This was a
report to DTI and was a reference in a paper by Carol Handwerker of NIST
representing iNemi published in Circuits Assembly March 2005, Printed
Circuit Design, and ???

I happen to be reading Carol's report again, right now, and some of the
references like the one from Intel which seems similar in some ways to the
one by our other listserve buddy Rockwell C's Davy Hillman on mixing SAC
and SnPb.

Happy Hunting.

Yours in Engineering, Dave
Y i Engr, MA/NY DDave

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