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May 2008

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 12 May 2008 18:44:11 +0300
Content-Type:
text/plain
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text/plain (223 lines)
I would be very interested to learn of VP media that are not PFCs or 
their derivatives, which are controlled substances under the Kyoto 
Protocol. I agree that VP techniques are great except for the 
environmental and cost aspects.

Brian

Stadem, Richard D. wrote:
>  Ioan,
> There are now new chemicals used for VP soldering and this, plus the
> resurgent interest in a uniform heating technology (especially for
> lead-free solders) has spurred new interest in the process. We use VP
> for a number of applications and it works well for us. In fact, very
> well.
> I have attached information on a seminar for anyone interested in
> learning more about this technology.
> I saw a VP REWORK station at APEX that we are looking into also.
> Please note the comments in the abstract below about the new fluids now
> available.
> 
> 
> Upper Mid-west Chapter of SMTA is sponsoring a Vapor Phase Reflow
> discussion. 
> 
> If you are interested in Vapor Phase Reflow and how it helps eliminate
> gradient heating across the SMT assembly, then this seminar is a must
> see.
> Please RSVP at the bottom of this e-mail. 
> 
> The topic of this seminar is "Application of Vapor Phase Technology".
> Gradient
> temperature across a circuit board in reflow is not a new factor for
> manufacturing using convection ovens but is more significant with the
> introduction of lead-free processing when it comes to max temperatures
> of
> components. We have 2 speakers on tap for this discussion and they are: 
> 
> David Suihkonen 
> R&D Technical Services, Inc 
> 
> Anthony Primavera, PhD 
> Boston Scientific 
> 
> Date: Tuesday, May 20th, 2008 
> Cost: $20 Members / $30 Non-members 
> 
> Special Bring a Non-member promo: 
> All non-members that become members for this event are automatically in
> the
> drawing for an IPOD and get the reduced rate for attendance with this
> event.
> Another drawing for a second IPOD is for the existing members that
> attend. 
> 
> Location: Hennepin Technical College, Eden Praire Campus 
> RSVP: Click link at bottom of e-mail. 
> 
> Time/Agenda: 
> * 1:30 to 2:00 PM - Registration 
> * 2:00 to 2:45 PM - David 
> * 3:00 to 3:45 PM - Anthony 
> 
> Address/Directions to Hennepin Technical College: 
> Eden Prairie Campus 
> 13100 College View Drive 
> Eden Prairie, MN 55347 
> 
>>From 494 South: 
> Exit from 494 at Valley View Road. At the top of the ramp, go left.
> Follow
> Valley View Road to Highway 212 West. Proceed south on Highway 212 West
> approximately 2.5 miles. Turn right at College View Drive proceed to
> Eden
> Prairie Campus. 
> Building J 
> 
>>From 494 West: 
> Exit from 494 at Highway 212 west. Proceed south on Highway 212 west
> approximately 2 miles. Turn right at College View Drive proceed to Eden
> Prairie
> Campus. 
> Building J 
> 
> Abstract: 
> Complex, multilayer and heavy back plane circuit boards have been
> soldered
> using condensing vapor reflow technology for many years. However, Vapor
> Phase
> is finding new life in many applications where thermal uniformity,
> control of
> peak reflow temperatures, and lower peak temperatures for lead free
> soldering
> are required. In-line reflow soldering is currently dominated by
> convection
> furnaces as they provide good thermal process capabilities at a
> reasonable
> price, and high through put. One disadvantage, however, is that a
> temperature
> gradient occurs between small and large devices, area array components,
> components with a high thermal mass, and for many other reasons. As the
> high
> reliability industry is moving towards lead free soldering, and the
> drive to
> have better process controls in many applications, the need to reduce
> the
> temperature gradient across a product increases. As in many things,
> what's old
> is new again. Vapor phase soldering, which was a soldering standard
> process for
> many years, fell out of favor due to higher cost, the use of Freon and
> other
> CFC based chemistry, and batch processing. Vapor phase soldering,
> however, is
> being examined closely by many industries today, as an alternative to
> convection reflow for high reliability applications, such as medical
> electronics, military, avionics, high end telecommunication and
> automotive. In
> part, many of the technology detractors, have been overcome or
> eliminated.
> Several companies are now offering commercially available, in-line fully
> contained vapor reflow systems. Additionally, CFC based chemistry has
> been
> replaced by PFPE based inert fluids produced by 3M, Dupont, and Galden.
> The new
> systems are now designed such that the reflow vapor is self contained
> inside a
> sealed chamber, and all systems recover a substantial portion of the
> vapor into
> condensed fluid. The main advantage of vapor phase reflow is the
> uniformity of
> temperature across the entire assembly. As the fluid condenses on the
> surface
> of the PCB and components, the latent heat of condensation gives off all
> the
> reaction energy to heating the surfaces. This phase change occurs at the
> specific temperature of the fluid's boiling point. Temperature gradients
> of
> under 5 degrees are common with 1 degree possible. Vapor phase reflow
> technology, and the advantages are discussed in these presentations.  
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
> Sent: Monday, May 12, 2008 8:24 AM
> To: [log in to unmask]
> Subject: [TN] Vapor phase
> 
> Dear Technos,
> 
>  
> 
> I would like to get your expert opinion on the latest developments in
> the vapour phase technology. The last time this topic has been discussed
> here this was still an environmental hazard.
> 
>  
> 
> Here's the latest sales pitch:
> 
>  
> 
> Dear Convection Oven Users:
> 
> With Energy Costs Skyrocketing, You have a cheaper, efficient, and a
> better yield Alternative!!
> 
> Low Operating Cost, 110 Volt Machine, Run Lead and Lead Free
> Sequentially!! 
> 
> High Yield, Run your Lead Free Boards at 230 Degrees Uniform Temperature
> Distribution, No Circuit Board Delamination, Uses Environmentally
> Friendly Teflon 2 Liquid No Hazardous Florocarbons!
> 
>  
> 
> The questions are:
> 
> *       Are the advantages real, should I prefer vapour phase over
> convection in day by day reflow operations, from the technical point of
> view?
> 
> *       Would the technology finally be environmentally friendly?
> 
>  
> 
> Thanks,
> 
>  
> 
> Ioan
> 
>  
> 
> 
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