Advanced Troubleshooting the PCB Manufacturing Process
August 2, 2006 - Bannockburn, IL
Instructor:  Michael Carano, Electrochemicals, Inc.

This course will address advanced problem solving of printed wiring
board defects, and the following topics will be discussed:

* Lamination and other multilayer related defects
* Solderability and assembly issues 
* Electrodeposition defects: mouse bites, pitting, nodules, crown or
dome  plating, dog bone defects 
* Why assemblers want to blame the fabricators for defects 
* Copper plating reliability 
* Black pad phenomenon: new details on its cause and how to eliminate it

* How to improve plating distribution and throwing power 
* Imaging: defects, surface preparation, soldermask issues and defects,
process control 
* Metallization: microvoids/voiding, interconnect separation, hole wall
pullaway, glass coverage, metallizing high performance resins, wedge
voids 

For more information on this workshop, please cut and paste the
following into your browser:
http://www.ipc.org/calendar/2006/AdvTroubleshooting_0806/Advtroubleshoti
ng_806.htm.

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