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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Tue, 21 Jun 2005 12:23:07 +0200 |
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Hello Listservers,
there is a long discussion on that very point so for me it looks like alle
people fear to run into problems when rising solder temperature from 220°C
to 260°C but no one knows exactly. I'm only talking of the difference of
temperatures. For me it's no question that moisture is a problem in general.
The mentioned temperature rise is, calculatetd in absolut temperatures,
'only' by 8% which will rise due to basic physics
p * V / T = const.
the vapour pressure as well by 8%. I cannot believe that this rise will be
extreme critical.
For all who are interested: there is literature on water on the web (only in
German) written by Heiner Grimm, University Clausthal-Zellerfeld
(http://www.wissenschaft-technik-ethik.de/wasser.html). With the data given
there I calculated that one drop of water (~ 0.03 ml) completely vapourized
at 250°C will produce a volume of ~ 9 ml at 10 bar pressure. Even if there
is a calculation error this is extreme and it's easy to understand that
moisture is a problem. But what's about the difference of 8% ?
Wolf-Dieter Schmidt
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