One example could be co-deposition of lead in electolessly plated nickel,
as in ENIG... One nuance here might be whether put there on purpose
(intentionally) or simply known to be there as a consequence of stabilizer
formulation... jw

!! God Blesses !!

Jerry Wagner  Dept 0056  Environmental Engineering  B096-1
x56275  pg 58888-0658   (607)755-6275   fax: (607)755-6282
Huron Real Estate Associates, LLC  and  Endicott Interconnect Technologies,
Inc.
Via the Internet: [log in to unmask]  [NOTES: Jerome Wagner/Huron/EIT]




                      "Davy, Gordon"
                      <[log in to unmask]        To:       [log in to unmask]
                      COM>                     cc:
                      Sent by: Leadfree        Subject:  Re: [LF] Lead: Intentionally added but below 1000 ppm?
                      <[log in to unmask]
                      >


                      09/30/2005 11:29
                      AM
                      Please respond to
                      "(Leadfree
                      Electronics
                      Assembly Forum)";
                      Please respond to
                      "Davy, Gordon"






The responses to Ken Patel's inquiry about compliance of intentionally
added lead have all offered answers. I know that I have seen discussions
as to why including the provision for intentional addition in a document
is a bad idea, namely that it is practically unenforceable. Test methods
are being developed to determine concentration, but how does an
inspector determine intent? So I agree with Bev.

However, my real reason for posting is not to offer another answer but
just to satisfy my curiosity: For what purpose is lead intentionally
being added at such a low level, and what is it being added to?



Gordon Davy

Baltimore, MD

[log in to unmask]

410-993-7399


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