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| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Wed, 30 Jul 2003 12:52:02 -0500 |
| Content-Type: | text/plain |
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Hi Gebhard! The IPC-9701 document is a performance test method
specification as well as a qualification requirements document. The
specification contains detailed discussion about the need for the document
user to understand how his/her test methodology interacts with physics of
failure concepts. Tarun's question pertained more to test methodology than
a requirement. The use of a common test methodology (e.g. IPC-9701) would
be highly advantageous if a future data comparison was to be conducted. I
have successfully used the 9701 test methodologies for Pbfree solder alloy
investigations - there is still much work to be done on understanding all
of the physics of failure mechanisms but having a common testing approach
has been very useful.
Dave
"Gebhard.Neifer"
<Gebhard.Neifer@D To: [log in to unmask]
ELPHI.COM> cc:
Sent by: Leadfree Subject: Re: [LF] Accelerated Thermal Cycle Profile
<Leadfree@listser
v.ipc.org>
07/30/2003 11:01
AM
Please respond to
"(Leadfree
Electronics
Assembly Forum)";
Please respond to
"Gebhard.Neifer"
Hi all,
.....
thatīs true, but be aware, that these recommendations relate to
SnPb-solder, for pb-free alloys there simply is no standard.
A few days ago Doug Romm provided an updated list of "Semiconductor
Manufacturers Lead-Free Web links" to this forum. On this sites you can
find some ideas/suggestions, as well.
gebhard
Dave Hillman <[log in to unmask]> on 30.07.2003 16:47:05
Please respond to "(Leadfree Electronics Assembly Forum)"
<[log in to unmask]>; Please respond to
[log in to unmask]
To: [log in to unmask]
cc: (bcc: Gebhard Neifer/MEGAMOS)
GLT:
Class.: None
Subject: Re: [LF] Accelerated Thermal Cycle Profile
Hi Tarun! Take a look at the IPC-9701 document - it has a number of
recommendations/suggestions covering temperature dwell/ramp rates.
Dave Hillman
Rockwell Collins
[log in to unmask]
We are performing an accelerated thermal cycle test for Solder Joint
Reliability of Lead Free Alloy for a -40C to 85C automotive application.
We are using a slow thermal cycling chamber that takes a long time fall
time (60 Min) from 85C to -40C. In order to speed up our thermal cycle,
does anyone know the minimum requirements for soak(dwell) time at
temperature extremes and rise/fall time that can give us an acceptable
reliability data.
Regards,
Tarun Gupta
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