I see two types of profiles being discussed and they are very different
on purpose.  One type of profile is how to properly assemble components
to boards with Pb-free solder pastes.  This type of profile generally is
the minimum time and temperature to activate the solder flux used and
reach high assembly yields with minimum degradation of boards and
components.

The other type of profile is what suppliers of components should expose
their components to that ensures that the processes and materials will
successfully withstand the maximum times and temperatures that customers
worldwide are likely to use for assembly and rework.  This type of
profile when associated with the moisture preconditioning is often
called the Moisture Sensitivity Level (MSL) testing.  This type of
profile is varies by the issuing organization.  If the organization is
primarily driven by suppliers it is often characterized by minimum times
and temperatures.  If the issuing organization is dominated by users
(customers) the times and temperatures tend to be longer and higher.  Be
careful when you specify an "industry standard" to a supplier as the
standard may not give you the component or the margin on the component
you desire.

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