Join IPC in Maple Plain, Minnesota for these upcoming workshops hosted by OMG Electronic Chemicals, Inc.!
Fundamentals of Printed Circuit Board Fabrication
Tuesday, July 15, 2008 - 8:30 am-5:00 pm
Will your job will benefit if you have a clear and solid understanding of PCB technology? Are you ready to advance your career by expanding your capabilities and background? This course will help you build that foundation.
Advanced PWB Troubleshooting: Identification, Analysis and Prevention of Critical PWB Defects
Wednesday, July 16, 2008 - 8:30 am-12:00 pm
This intense workshop will provide tools for advanced problem solving for printed circuit boards manufacturing. Defects such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away carry significant costs.
Via Hole Filling Technology and Processes: An Overview
Wednesday, July 16, 2008 - 1:30 pm-5:00 pm
Hosted by OMG Electronic Chemicals, Inc.
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and processes that will enable the move towards sequential lamination, blind and buried vias, and via-in-pad technology.
For more information, please cut and paste http://www.ipc.org/calendar/2008/FabWorkshopSeriesHostedbyOMG0708/FabWorkshop0708.htm into your browser or contact Michelle Michelotti at +1 847-597-2822 or via email at [log in to unmask]<mailto:[log in to unmask]>.
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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