Actually, it's more like 0.003, but who's counting. I have less of a
worry because I spec 0.0012 minimum and still have Tin/Lead over copper
in the hole. The people who have been lead to believe OSP over copper
with a SAC process is completely acceptable need to worry. And in the
Aerospace arena we will never be able to limit the reworks. Control of
the rework process is critical. The IPC didn't help in this area by
combining IPC-7711 and IPC-7721 and not recognizing the need to
establish requirements based on materials, process and Lead-free
acceptance criteria.
Dewey

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of MA/NY DDave
Sent: Thursday, September 21, 2006 12:06 PM
To: [log in to unmask]
Subject: Re: [LF] FW: [TN] Dissolving copper hole wall using lead free
HASL?

Hi Karl, John, IPC LF Listservers,

<Thilo Sack of Celestica has some good data on this.  The most common
SAC
alloys have 2-3X the copper dissolution rate of eutectic tin-lead at the
same temperature.>

Roughly what would that be in .0001 inches (tenths of mils)?

My concern is initial plating thickness and number of allowed reworks.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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