The solder paste being used is a lead-free formula from Koki, S3X58-M301-3
series.  This is using a Sn96.5 / Ag3.0 / Cu0.5 formula using a no-clean
flux.

Rick Thompson

===== Original Message from [log in to unmask] (Leadfree Electronics Assembly
Forum) at 1/27/03 12:40 pm
>You need to give a bit more details, like the kind of solder alloy and flux
>you are using
>
>-----Original Message-----
>From: Rick Thompson [mailto:[log in to unmask]]
>Sent: January 27, 2003 2:05 PM
>To: [log in to unmask]
>Subject: [LF] Immersion gold vs flash gold with Lead-free solder paste?
>
>
>Has anyone had any experience using Lead-free solder paste on a Flash gold
>finish?  We're currently having some solder wetting issues with lead-free on
>flash gold where some of the pads on the boards exhibit complete lack of any
>wetting.  It almost looks like what you get when you reflow solder paste on
>a ceramic substrate, where the solder just balls up.  Is this an inherent
>problem with flash gold or do I have some kind of abnormal processing issue
>at the board vendor?
>
>Thanks in advance.
>
>Rick Thompson
>
>Sr. SMT Process Engineer
>SMTEK International, Inc.
>+1 (805) 532-2800
>[log in to unmask]
>
>
>Rick Thompson
>
>Sr. SMT Process Engineer
>SMTEK International, Inc.
>+1 (805) 532-2800
>[log in to unmask]
>
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Rick Thompson

Sr. SMT Process Engineer
SMTEK International, Inc.
+1 (805) 532-2800
[log in to unmask]

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