Peter Brooks writes: "Maybe this is the time to consider the elimination of
the solder assembly
process?"
I have heard this sentiment before. Does anyone see this as feasible? I
always have been under the impression that it is not, considering the lack
of electrical conductivity, rework-ability, and strength of conductive
adhesives.
Is there a general consensus on this issue?
-----Original Message-----
From: Brooks, Peter <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, July 07, 1999 8:29 AM
Subject: Re: [LF] Component reliability at higher soldering temperatures
>David:
>
>Obviously there is a point (more like a cliff edge) where any component
will
>fail. I have internally asked our reliability department to come up with an
>assembly "not to exceed" profile (maximum ramp/cooling rate and maximum
>time/temperature etc) that could be used as boundary conditions for this
>project.
>
>The comment that came back was that this is "IMPOSSIBLE" considering all
the
>different packages/materials used for IC's and Discretes.
>
>Maybe this is the time to consider the elimination of the solder assembly
>process?
>
>Peter Brooks
>
> -----Original Message-----
> From: David Suraski - AIM [SMTP:[log in to unmask]]
> Sent: Wednesday, July 07, 1999 7:36 AM
> To: [log in to unmask]
> Subject: Re: [LF] Component reliability at higher soldering
>temperatures
>
> Are there any component manufacturers involved in this forum who
could
> comment on the issue below (and others)?
>
> Thanks,
>
> David
>
> -----Original Message-----
> From: Charbonneau, Richard A <[log in to unmask]>
> To: 'David Suraski - AIM' <[log in to unmask]>
> Cc: 'Seelig, Karl (AIM solder)' <[log in to unmask]>
> Date: Tuesday, July 06, 1999 6:55 PM
> Subject: Component reliability at higher soldering temperatures
>
>
> >re: recent posting to IPC Lead-free forum
> >
> ><edited>
> >
> >we have found that most components can withstand this extra heat
w/no
> >degradation to their reliability....
> >
> >David, I would like to respond to your comment.
> >
> >The feedback that we are receiving from our supplier base is that
the
> higher
> >soldering temperatures (even the lower 240 peak profile)is a
>reliability
> >concern for a wide range of purchased parts including film
capacitors,
> >switchs, relays, connectors, crystals, hybrids and optoelectronic
>devices
> to
> >name a few.
> >
> >regards,
> >
> >richard charbonneau
> >
> >
> >
>
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