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July 1999

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Subject:
From:
David Suraski - AIM <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Wed, 7 Jul 1999 08:32:54 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (142 lines)
Peter Brooks writes: "Maybe this is the time to consider the elimination of
the solder assembly
process?"

I have heard this sentiment before. Does anyone see this as feasible? I
always have been under the impression that it is not, considering the lack
of electrical conductivity, rework-ability, and strength of conductive
adhesives.

Is there a general consensus on this issue?

-----Original Message-----
From: Brooks, Peter <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, July 07, 1999 8:29 AM
Subject: Re: [LF] Component reliability at higher soldering temperatures


>David:
>
>Obviously there is a point (more like a cliff edge) where any component
will
>fail. I have internally asked our reliability department to come up with an
>assembly "not to exceed" profile (maximum ramp/cooling rate and maximum
>time/temperature etc) that could be used as boundary conditions for this
>project.
>
>The comment that came back was that this is "IMPOSSIBLE" considering all
the
>different packages/materials used for IC's and Discretes.
>
>Maybe this is the time to consider the elimination of the solder assembly
>process?
>
>Peter Brooks
>
>        -----Original Message-----
>        From:   David Suraski - AIM [SMTP:[log in to unmask]]
>        Sent:   Wednesday, July 07, 1999 7:36 AM
>        To:     [log in to unmask]
>        Subject:        Re: [LF] Component reliability at higher soldering
>temperatures
>
>        Are there any component manufacturers involved in this forum who
could
>        comment on the issue below (and others)?
>
>        Thanks,
>
>        David
>
>        -----Original Message-----
>        From: Charbonneau, Richard A <[log in to unmask]>
>        To: 'David Suraski - AIM' <[log in to unmask]>
>        Cc: 'Seelig, Karl (AIM solder)' <[log in to unmask]>
>        Date: Tuesday, July 06, 1999 6:55 PM
>        Subject: Component reliability at higher soldering temperatures
>
>
>        >re: recent posting to IPC Lead-free forum
>        >
>        ><edited>
>        >
>        >we have found that most components can withstand this extra heat
w/no
>        >degradation to their reliability....
>        >
>        >David, I would like to respond to your comment.
>        >
>        >The feedback that we are receiving from our supplier base is that
the
>        higher
>        >soldering temperatures (even the lower 240 peak profile)is a
>reliability
>        >concern for a wide range of purchased parts including film
capacitors,
>        >switchs, relays, connectors, crystals, hybrids and optoelectronic
>devices
>        to
>        >name a few.
>        >
>        >regards,
>        >
>        >richard charbonneau
>        >
>        >
>        >
>
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>IPCWorks -October 25-28 featuring an International Summit on Lead-Free
Electronic
>Assemblies.
>Please visit IPC's Center for Lead-Free Electronics Assembly
>(http://www.ipc.org/html/leadfree.htm ) for additional information.
>For technical support contact Gayatri Sardeshpande [log in to unmask] or
847-790-5365.
>################################################################
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Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
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To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe:   SUBSCRIBE Leadfree <your full name>
To unsubscribe:   SIGNOFF Leadfree
################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.ipc.org/html/leadfree.htm ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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