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Subject:	Re: PCB finishing type for lead free solution with CSP, BGA & press-fit connector
From:	Peter Lymn <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Mon, 11 Aug 2003 15:45:03 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (52 lines)

Have you considered using lead free Solder as the final finish?   Solder
Coating and Hot Air Leveling can provide finishes compatible with the
component types/ assembly techniques your proposing...

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 11 August 2003 08:56 AM
To: [log in to unmask]
Subject: [LF] PCB finishing type for lead free solution with CSP, BGA &
press-fit connector


Hello,

  We have a new project with a very complicated assembly model.

   Both side SMT  (BGA, CSP, CCGA & QFP .....) , THT ( a lot od dip
component ) and some press-fit connectors.

   Who can provide any recommendations for the PCB finishing type ?

     Selective imm. Au with OSP ?
   Or immersion silver ? Immersion Tin ?

     Why ? And why not ?


 Irving


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