Why does this happen anyways?  Is it due to the higher Sn content? In this case shouldn't SN100C be even tougher? Why did I hear then that SN100C will be OK where SAC is too agressive?

Thanks,

Ioan

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Karl Sauter
Sent: Thursday, September 21, 2006 4:05 PM
To: [log in to unmask]
Subject: Re: [LF] FW: [TN] Dissolving copper hole wall using lead free
HASL?


Dave,

That depends upon your assembly profile and peak temperature, as well as
starting copper thickness in the plated-through hole.  At temperatures
higher than 230 C a SAC alloy will dissolve copper more than 3x as fast
as eutectic tin-lead at 230 C.  Especially at the knee of a plated
through hole, a pin soldered-in with SAC alloy may barely allow 1 rework
depending upon your minimum copper at the knee of the hole requirements
for finished assemblies.

Regards,
Karl Sauter

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