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May 2005

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Subject:
Re: Pb Sn Stripped PCB and Rohs
From:
Mark Hargreaves <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 25 May 2005 10:35:01 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (57 lines) 
Hi Dave,
A. The tin lead process is on our replacement list (stuck below more
"crucial" expenditures). Cost of the bath changeover to straight tin and
increased bath upkeep cost are factors. In addition, the process still meets
our needs & requirements, so there's not a sense of urgency.

B.   We can't reflow the plated tin lead because it covers all circuitry,
not just the pads.  (Not compatible with the "OBC" part of the SMOBC
process).

Regards, & thanks forum for the responses.
Mark

        -----Original Message-----
        From:   MA/NY DDave [SMTP:[log in to unmask]]
        Sent:   Wednesday, May 25, 2005 1:19 AM
        To:     [log in to unmask]
        Subject:        Re: [LF] Pb Sn Stripped PCB and Rohs

        Hi Roger, Mike, IPC LF Listservers,

        Thanks,


        Why isn't this process of tin lead as an etch resist, and then later
        completely stripped rather than reflowed for superbe long term
storage and
        solderability, on a replacement list?


        Yours in Engineering, Dave
        YiEngr, MA/NY DDave


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