Hi Dave

Would be great to get a copy of your tests. Not that I am too lazy to do
the dirty work but I'd like to know what others do.
Well Dave I think you are still a bit hurt by my comment I did in the last
1000 years. I really want to apologize for that. Never thought in hurting
somebody.

Best regards

Guenter


Guenter Grossmann
Swiss Federal Institute for Materials Research and Testing EMPA
Ueberlandstr. 129
CH- 8600 Duebendorf
Switzerland

--------------------------------------------------------------------------------
--------------------------------------

>Hi All,
>
>Happy holidays!  We've also done some tests pertaining to Cu and Pb in a
>Pb-Free solder that will not be named due to fears of being flamed.
>
>Anyhoo, we found that Cu would not dissolve into this composition (which had
>an original Cu concentration of 0.7%) above 1% in a solder bath of 500F.  As
>an aside, this alloy proved superior as far as limiting Cu dissolution as
>compared to Sn/Pb, Sn/Ag, and even Sn/Cu. I imagine that this probably is
>quite similar to Mr. Gickler's results.
>
>As far as Pb, the above alloy was tested with 0.5% pb-contamination (which
>was deemed to be a realistic contamination level that might be experieinced
>in the field) with "little or no degradation" to solder joint reliability.
>
>I realize that the above may sound a bit subjective, but it actually was
>determined through objective experimentation. If anyone (including Mr. Yuen,
>of course) would like to see a copy of these tests and their results, please
>feel free to contact me and I'll ship it off.
>
>Thanks and happy new year,
>
>David
>AIM

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