John,
Are the areas affected both solid and/or cross hatched balance areas too?
Have you a correlation of threshold area size to delamination?
Were the board dried?

Interesting work.

Regards,
Phil.

-----Original Message-----
From: John Burke [mailto:[log in to unmask]]
Sent: 10 November 2005 19:03
To: [log in to unmask]
Subject: [LF] Delamination on lead free reflow cycling


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I have been cycling some bare test boards to the JEDEC 020 spec for lead
free reflow trials. I have noticed a tendency for early de-lamination of
areas of the board with copper flood fill on the surface.

This is only occurring after extended cycling, and I have the same effect
from 3 different board manufacturers using 3 different high temperature
laminate constructions.

Anyone else noticed this??

John

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