Hi Christopher, just read your message and wanted to comment on the
definition of homogeneous materials. Although as you mentioned impractical
to disjoin the IC, the .1% lead by weight requirements is based upon the
Lead content of the solder on the lead frame. It is not based upon the Lead
content of the lead frame itself but of the solder on the lead frame. You
will have to request this information from your suppliers and manufacturers
of the components. They will have to supply you with Material Declaration
Forms identifying the materials contained in the product down the weight
percentage of each relative to the total weight of the package. Design
engineers will now have to collect all these forms and define the total
weight percentage of Lead in their product and again it is not based upon
the weight of the product but of the weight of the solder within the system
itself.
If it was based upon the weight of the product, then extra weight could be
added to the product to make it meet the requirements of the law. From an
old saying of a long time ago when we were chasing CFC and other cleaning
solvents, dilution was not the cure to pollution. The same applies here,
adding weight is not the cure to solving this issue.
Hope this information is useful.
Check our website for lead free information and links to DCA website for
more information.
Leo Lambert
Technical Director
EPTAC Corp.
Longfellow Square, Bldg. II
8025 So. Willow St., Unite 207
Manchester, NH 03103
P. 800-643-7822 ext 15
F. 603-296-2377
[log in to unmask]
www.eptac.com
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Christopher Lawson
Sent: Tuesday, October 12, 2004 12:18 PM
To: [log in to unmask]
Subject: [LF] Pb-free definition (and partial response to G Anderson)
As a newcomer to the electronics industry, my knowledge is pretty
limited, but I think I have a firm grasp on the basics. First, to
answer Greg, I think it would be economically and practically unfeasible
to strip the leads of components of the lead coating and reapply an
"approved" material to the stripped lead. However, like I said, I am a
newcomer, so any information to the contrary would be appreciated.
Now, as to my question, I was wondering whether or not the EU has
adopted the Guidance Document drafted, I believe, in mid-June, stating
that "a maximum concentration value of 0.1% by weight in homogenous
materials... shall be tolerated." The GD goes on to define homogenous
materials as any material that can not be mechanically disjointed, in
principle, by mechanical actions (unscrewing, cutting, etc.). Any word
on whether this is actually part of the RoHS directive now? If so, what
exactly does the "in principle" clause mean? Does that mean practical?
If so, then components shouldn't apply as it is impractical to
mechanically disjoint them.
Thoughts? Comments? Thanks!
--
Christopher Lawson
*/ProtoRun /*
[log in to unmask] <mailto:[log in to unmask]>
(630) 446-4200 x116
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