Hi,

I have a question on electroplated gold finish for
PCB.

1.) Why is it that some companies require 30
microinches electroplated gold all over?
2.) Why is it that some companies require 30
microinches selective hard gold especially in BGA
areas?

My understanding is that if the gold plating is too
thick, this would result in poor solderability.  I
thought before that the 30 microinches hard gold is
usually used for edge connectors.  Wouldn't it be
cheaper for companies to use ENIG instead for the
solderable areas?



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