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November 2004

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(Leadfree Electronics Assembly Forum)
Date:
Mon, 15 Nov 2004 11:21:11 -0600
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Hi

I am looking at labelling our assemblies with the solder alloys used so
that the same alloys can be used for rework. If we reflow and hand solder
with SAC alloy and wave solder with SnCu a typical assembly may have:

topside reflow (SAC), bottom side reflow (SAC) and selectively wave solder
through hole parts (SnCu)

or

topside reflow (SAC) and wave solder bottom side smt and through hole parts
(SnCu)

or

topside reflow (SAC), bottom side reflow (SAC) and hand solder through hole
parts (SAC)

My question is do I need to label to this level of detail?

Does it matter if I do all my lead free rework with SAC alloy ie will
reliability be affected if parts soldered with SnCu are touched up /
reworked with SAC? - This would make life a lot simpler!

Thanks

Keith

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