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December 2008

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Subject:
From:
Michael Taylor <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 8 Dec 2008 15:35:36 -0600
Content-Type:
text/plain
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text/plain (89 lines)
http://www.pcb007.com/pages/zone.cgi?a=46891&artpg=1
I had trouble with Joe's link, here is a similar link.

Michael J. Taylor
DDi
P.O. Box 1808
Longmont, Colorado
303.845.2959

1220 Simon Circle
Anaheim, California  92806

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-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Monday, December 08, 2008 1:45 PM
To: [log in to unmask]
Subject: [BULK] [LF] vibration testing of tin-lead and lead-free solder
joints
Importance: Low

 
Greetings  folks 
Found this  on the wires today... (Cut it earlier out but lost the link
but I 
am  sure I am not the only one who read it. However I can go dig it up
if  
there is interest)   
Why are we  still using lead-free solder again? So it goes.... 
Joe 
"Davide de  Maio of National Physical Laboratory discussed the high
frequency 
vibration  testing of tin-lead and lead-free solder joints, with
reference to 
automotive  and aerospace electronics--a grim reminder that 80% of
failures 
in airborne  electronics were attributable to vibration and shock. A
test piece 
had been  designed representing a single solder joint between two copper

components, which  was tested to failure at frequencies of 400Hz and
800Hz. A 
range of SAC  lead-free solders had been evaluated, with tin-lead as a
comparison. 
The  tin-lead solder outperformed the lead-free examples, especially at
the 
higher  frequency. In general, failure occurred at or near the
intermetallic 
interface,  which would be expected to be the most stressed area. Of the
SAC 
alloys,  performance at 400Hz was better the higher the silver content.
Annealing 
of SAC  had a deleterious effect on performance at both 400Hz and
800Hz."
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favorite sites in one place.  Try it now. 
(http://www.aol.com/?optin=new-dp&icid=aolcom40vanity&ncid=emlcntaolcom0
0000010)

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