http://www.pcb007.com/pages/zone.cgi?a=46891&artpg=1
I had trouble with Joe's link, here is a similar link.
Michael J. Taylor
DDi
P.O. Box 1808
Longmont, Colorado
303.845.2959
1220 Simon Circle
Anaheim, California 92806
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-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Monday, December 08, 2008 1:45 PM
To: [log in to unmask]
Subject: [BULK] [LF] vibration testing of tin-lead and lead-free solder
joints
Importance: Low
Greetings folks
Found this on the wires today... (Cut it earlier out but lost the link
but I
am sure I am not the only one who read it. However I can go dig it up
if
there is interest)
Why are we still using lead-free solder again? So it goes....
Joe
"Davide de Maio of National Physical Laboratory discussed the high
frequency
vibration testing of tin-lead and lead-free solder joints, with
reference to
automotive and aerospace electronics--a grim reminder that 80% of
failures
in airborne electronics were attributable to vibration and shock. A
test piece
had been designed representing a single solder joint between two copper
components, which was tested to failure at frequencies of 400Hz and
800Hz. A
range of SAC lead-free solders had been evaluated, with tin-lead as a
comparison.
The tin-lead solder outperformed the lead-free examples, especially at
the
higher frequency. In general, failure occurred at or near the
intermetallic
interface, which would be expected to be the most stressed area. Of the
SAC
alloys, performance at 400Hz was better the higher the silver content.
Annealing
of SAC had a deleterious effect on performance at both 400Hz and
800Hz."
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