LEADFREE Archives

January 2002

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Subject:
From:
James Canner <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 17 Jan 2002 14:24:03 -0500
Content-Type:
text/plain
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text/plain (27 lines)
I do not like broad generalizations.  I would say that Nickel plating if
continuous, is an effective deterrent to tin whiskers.  However nothing is
perfectly continuous.   NASA is reporting a case of tin whiskers due to a
hole in the plating.  So the effective solution for surface mount
components is to be sure that all surfaces are solder coated after
assembly.  The tin plating is no longer a factor at that point.

I would assume the same would be true of board finishes.

James P. Canner
Product Development Engineer
Murata Electronics North America
1900 W. College Ave
State College PA 16801-2799
(814)-237-1431 x 2032
[log in to unmask]

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