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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 17 Aug 2005 09:02:28 -0400 |
Content-Type: | text/plain |
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Dave
In the middle nineties Bruce Horton chaired an IPC investigation into the performance of several metallic solderability finishes including the ones you mentioned. I imagine you could purchase a copy through the IPC bookstore.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: MA/NY DDave<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Tuesday, August 16, 2005 10:38 PM
Subject: [LF] PWB (Board) finishes: Pal
Hi IPC LF Listservers,
In an article I recently gave a link for, there was a section on Board
(PWB) finishes for Lead-free.
I have never heard of Palladium or Palladium over Nickel as a board finish.
I do know about Palladium used in component lead, and lead frame finishes
so I think it was an author mistake.
SO - - -, Does anyone know of Palladium or Palladium over Nickel as a board
finish??
Yours in Engineering, Dave
YiEngr, MA/NY DDave
P.S. Yes I have written the magazine editor, yet I also wanted to ask here.
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