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August 2005

Leadfree@IPC.ORG

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 17 Aug 2005 09:02:28 -0400
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Dave

In the middle nineties Bruce Horton chaired an IPC investigation into the performance of several metallic solderability finishes including the ones you mentioned. I imagine you could purchase a copy through the IPC bookstore.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389  
  ----- Original Message ----- 
  From: MA/NY DDave<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Tuesday, August 16, 2005 10:38 PM
  Subject: [LF] PWB (Board) finishes: Pal


  Hi IPC LF Listservers,

  In an article I recently gave a link for, there was a section on Board
  (PWB) finishes for Lead-free.

  I have never heard of Palladium or Palladium over Nickel as a board finish.
  I do know about Palladium used in component lead, and lead frame finishes
  so I think it was an author mistake.

  SO - - -, Does anyone know of Palladium or Palladium over Nickel as a board
  finish??


  Yours in Engineering, Dave
  YiEngr, MA/NY DDave

  P.S. Yes I have written the magazine editor, yet I also wanted to ask here.

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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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