Based on testing we have done the 96.5 Sn/3.5 Ag will behave very close to
the SAC alloys in wavesolder and it doesn't take long to pick up some
copper and then its just like SAC 305. I have heard some say that you may
get more voiding is SMT than you do with the SAC alloys.
Can you tell me where to get a copy of this test report?





Ken Kirby
Applications Engineer
Speedline Technologies
573-346-3341 ext 162
cell 817-946-3357



             Richard
             Kraszewski
             <[log in to unmask]                                          To
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                                       [LF] 96.5% Tin / 3.5% Silver vs.
                                       SAC305
             08/01/05 11:17 AM


             Please respond to
                "(Leadfree
                Electronics
             Assembly Forum)"
             <[log in to unmask]
             >; Please respond
                    to
                  Richard
                Kraszewski
             <[log in to unmask]
                   COM>






Just reviewed the IPC SPVC report on the SAC alloys.  2 thumbs up on
that effort!!!  Now for the question at hand.



Seeing that there seemed to be little performance difference amongst the
3 alloys being considered, what if you go one step further.  Would all
of you think that an alloy such as 96.5 Sn/3.5 Ag would perform equally
well?  Sure the melt point is ~ 4 degC higher , but with some copper
contamination whether it be in a TH or SM, won't you think the
performance would be very similar to say SAC305?



Reason I'm asking is that I'm supporting some 96.5% Tin / 3.5% Silver
processes, and need to determine if I switch them over to SAC305 or let
them continue as they are.



Your thoughts would be appreciated.



Rich K KEDS












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