FYI: looks like it is a high lead related issue - probably in a move to
comply with RoHS - by adding lead to the bumping process..?????

 

Quote:

 

"What supports the theory that a high-lead solder bump in fact is at fault
is the fact that Nvidia ordered an immediate switch to use eutectic solders
instead of high-lead versions in the last week of July. Eutectic solders are
believed to solve the problem of fatigue cracking."

 

Link is here:

 

http://www.tomshardware.com/news/Nvidia-GPU-failure,6248.html

 

 

Kind regards,

 

John Burke

 

 


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