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October 2003

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 10 Oct 2003 11:19:31 -0500
Content-Type:
text/plain
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text/plain (29 lines)
Hi Qualcomm-Phil, and IPC LF Listservers,

Thanks Gordon, I forgot to list the Goddard Link.

Now Phil that heart monitor legal case is interesting reading.
And of course the Nasa link is also neat.

http://nepp.nasa.gov/whisker/reference/tech_papers/Brusse2003-Zinc-Whisker-
Awareness.pdf

If I were you I would contract out with some consultant about how to
properly accelerate this failure. My thoughts are that you have been going
about this the wrong way thinking that it is ONLY a plating condition. I
have lots of ideas how to pronounce and accelerate this defect yet the
question becomes what is the Acceleration factor and how to arrive at that
factor. One of my many quick ideas is try lowering your DC voltage, take
the part through some gradual heat cycles, and do some reasonably soft
cycle bending.

YiEngr, MA/NY DDave

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