LEADFREE Archives

July 1999

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Subject:
From:
"Bernier, Dennis" <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Wed, 28 Jul 1999 16:59:26 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (140 lines)
There are many reasons for NOT using lead-free solder alloys that melt so
much higher than Sn63Pb37, component and reliability problems being at the
top of the list.  However, if organizations, such as IPC, continue to
promote the "Get the Lead Out" slogan, it will become POPULAR to push the
electronics industry into the unknown realm of new alloys and new problems.

There is no question that the USE of lead-free alloys will result in higher
cost at very little benefit.

-----Original Message-----
From: Bill Grajek [mailto:[log in to unmask]]
Sent: Wednesday, July 28, 1999 3:40 PM
To: [log in to unmask]
Subject: Re: [LF] New Topic?


Going to 260 C is really pushing the window on how well a small wire wound
inductor will survive.
The lowest magnet wire insulation is 105C continuous rated. Most of our
inductors are wound with either UL Class B (130C), 155C, or 180C grade
insulated magnet wire. So, if the soldering temperature is approaching twice
the magnet wire insulation rating, even though it is buried inside the
device,
I am not so sure about the effects for long term reliability. The duration
and
temperature exposure are a critical balance as it is for survival utilizing
current PCB assembly methods.

We have seen many a part come back to us from out of control IR processing
ovens with the red insulation of the magnet wire oozing out of the part and
the
customer complaining about having deads. The fix has been to go to higher
thermal grade raw materials to enable our parts to survive up in that range
for
soldering. All of this has come at a cost. Can't say that it's been a easy
change for manufacturability, but the results have proven to be positive in
allowing higher soldering temperatures.

Nevertheless, is the industry ready for component price increases just to
allow
for elevated processing temperatures?

Best Regards,
Bill Grajek
Applications Engineering Manager
API Delevan, Inc.

----------
> From: Brooks, Peter <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [LF] New Topic?
> Date: Wednesday, July 28, 1999 12:25 PM
>
> Well I for one expect big time problems going up in temperature to 260 C.
>
> One of the suggestion I made to the NEMI lead free component subgroup is
to
> actually go out and test current packages to see what happens.
>
> Pete Brooks
> Harris Semiconductor
>
>         -----Original Message-----
>         From:   David Suraski - AIM [SMTP:[log in to unmask]]
>         Sent:   Wednesday, July 28, 1999 11:24 AM
>         To:     [log in to unmask]
>         Subject:        [LF] New Topic?
>
>         Where is everyone? Don't tell me that all lead-free questions have
been
> resolved!
>
>         Are there any component folks on the group now? If so, do any of
you
> have any comments as to the ramifications of increasing reflow peak temps
to
> 240C, 250C, 260C, etc.? We were discussing reliability issues a couple of
weeks
> ago, but I'm not sure how many questions actually were resolved.
>
>         Thank you and best regards,
>
>         David Suraski < [log in to unmask]
<mailto:[log in to unmask]>>
>         Technical Marketing Specialist
>         AIM < www.aimsolder.com <http://www.aimsolder.com>>
>         25 Kenney Drive/Cranston, RI 02920
>         Tel: 401-463-5605/1-800-CALL-AIM/Fax: 401-463-0203
>
>
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> IPCWorks -October 25-28 featuring an International Summit on Lead-Free
Electronic
> Assemblies.
> Please visit IPC's Center for Lead-Free Electronics Assembly
> (http://www.ipc.org/html/leadfree.htm ) for additional information.
> For technical support contact Gayatri Sardeshpande [log in to unmask] or
847-790-5365.
> ################################################################

################################################################
Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe:   SUBSCRIBE Leadfree <your full name>
To unsubscribe:   SIGNOFF Leadfree
################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free
Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.ipc.org/html/leadfree.htm ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or
847-790-5365.
################################################################

################################################################
Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask]
with following text in the body:
To subscribe:   SUBSCRIBE Leadfree <your full name>
To unsubscribe:   SIGNOFF Leadfree
################################################################
IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.ipc.org/html/leadfree.htm ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
################################################################

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