LEADFREE Archives

November 2005

Leadfree@IPC.ORG

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 3 Nov 2005 23:12:03 -0600
Content-Type:
text/plain
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text/plain (30 lines)
Hi Werner, IPC LF Listservers,

Werner, I think that most PCB manufacturers expect that a pre-soldering
process bake will solve all the problems with embedded moisture and even
some chemicals. Hey it solves solder pop voids, blow outs, cracks, , when
stuff gets entrapped.

To me it seems like you either use the pcb quickly, store it correctly in
low moisture, or bake it to stop MSL difficulties. In Lead Free it seems
like baking is going to become a standard process for most locations using
lower cost laminates with higher soldering temperatures due to components
or PCB structure.

In addition you have a few tests that tell you if your process has created
chemical problems that are imbedded in the laminate structure.

So I don't see the need, unless for laminates that are touted as not
needing pre-solder baking.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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