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January 2008

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Subject:
From:
Pete Houwen <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 30 Jan 2008 14:38:36 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
I appreciate all of the inquiries to help track this down, but in the interest of 
expediency:

We have a manufacturing facility that has been in operation for a little over a 
year, all but a few of the staff were hired with no experience in electronics, 
other than some local government soldering classes.  Some of them make 
airport baggage handlers look gentle.

After a small number of failures attributed to open solder joints in a new 
product about to launch, we contracted a highly recommended lab to do some 
FA on  few boards.  They have ruled out most of the common brittle joint 
problems, finding generally good solder joints and a high degree of mechanical 
stress.

We know we need to fix our handling problems, but I don't believe we can say 
with any certainty there will not be partial fractures that get through testing.  
I'm being asked to provide what degree of confidence we might have in our 
long term reliability (assuming we address the handling).

If I can keep the problem limited to the corner joints, I'm pretty confident.  
It's those pesky little fracture mechanics on other joints that I'm worried 
about.

Pete

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