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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 30 Jan 2008 14:38:36 -0600 |
Content-Type: | text/plain |
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I appreciate all of the inquiries to help track this down, but in the interest of
expediency:
We have a manufacturing facility that has been in operation for a little over a
year, all but a few of the staff were hired with no experience in electronics,
other than some local government soldering classes. Some of them make
airport baggage handlers look gentle.
After a small number of failures attributed to open solder joints in a new
product about to launch, we contracted a highly recommended lab to do some
FA on few boards. They have ruled out most of the common brittle joint
problems, finding generally good solder joints and a high degree of mechanical
stress.
We know we need to fix our handling problems, but I don't believe we can say
with any certainty there will not be partial fractures that get through testing.
I'm being asked to provide what degree of confidence we might have in our
long term reliability (assuming we address the handling).
If I can keep the problem limited to the corner joints, I'm pretty confident.
It's those pesky little fracture mechanics on other joints that I'm worried
about.
Pete
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