LEADFREE Archives

August 2006

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 25 Aug 2006 10:19:10 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (127 lines)
Yes, I've already blamed a faux pas on over-exposure to Lead-free.
Dewey

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, August 25, 2006 10:17 AM
To: [log in to unmask]
Subject: Re: [LF] Copper Pad Peel Strength

Recent rash = epidemic?

Couldn't be the lead free profile disease outbreak in
progress..........could it??

John

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Friday, August 25, 2006 6:43 AM
To: [log in to unmask]
Subject: Re: [LF] Copper Pad Peel Strength

There seems to be a rash of this lately. Could you offline tell me what
laminate material you use for the bare board.
Dewey

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
Sent: Friday, August 25, 2006 4:30 AM
To: [log in to unmask]
Subject: [LF] Copper Pad Peel Strength

Dear Technetters,
We are having instances where copper pads (Under BGAs) are being lifted
off ENIG Boards almost too easily during rework. We use the same thermal
profile on each board (for the same component removal) and only some
show this phenomenon. Is there a test or standard to test the copper
adhesion @ incoming to see whether it's the fab (i.e. are the boards
coming to us with poor copper adhesion strength to being with) or the
process that's doing this. The board is heated upto 120 C when the
component is reflowed for removal. Also, is there data to show the
decrease in Cu adhesion strength with temp?

Thanks,

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing, Inc.
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
www.harvardgrp.com




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1.8d
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks
send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
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