Bev,
Yes you're right of course. I've seen plenty of reports, though, that are
clearly generated by grinding the entire device and doing the analysis on
that...and consequently coming out with a less-than-conclusive result. Not
all OEMs, Distributors, Contract Manufacturers, and Component Manufacturers
have a good understanding of the requirement.
Regards,
Mike
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, November 02, 2005 8:10 AM
To: (Leadfree Electronics Assembly Forum); Michael Kirschner
Subject: RE: [LF] Scarier still
Michael,
Grinding still works, if you have a good enough knowledge of your
component base so you can remove the ones with high Pb die attach BEFORE
grinding. I would also suggest grinding the board a quadrant at a time,
so if there is a problem you have narrowed it down a bit.
Bev
RIM
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Michael Kirschner
Sent: November 2, 2005 10:46 AM
To: [log in to unmask]
Subject: Re: [LF] Scarier still
Interesting. How did the disti test the parts and where was the Pb
found? Pb
in ICs, for instance, can exist internally to parts as >85% the die
attach
(power components, particularly) and as such is exempt. So grinding the
whole thing up is, as this list knows, not the right approach to
determining
homogeneous material content. And what proof was provided that the parts
were, in fact, compliant?
Fun indeed...
Mike
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