Hello Vladimir,
I have read your work on creep of SAC solders in the Journal of Electronic
Materials, and found it very interesting, especially with respect to the effect
of Ag contents on rupture time.
We met in Toronto a few years ago, when you advocated a micro-mechanism
based approach for lead-free solder joint life predictions. I am all for it, and
I am interested in all possible approaches that can help us predict solder
joint life in real board assemblies.
I am curiious about how your model is coming along and how your predictions
compare to thermal cycling results. Do you have publications / reports you
can refer us to?
Thanks,
Jean-Paul
In a message dated 11/16/2005 12:20:47 PM Eastern Standard Time,
[log in to unmask] writes:
I knew you wouldn't agree :-).I also knew, you can do it for Pb-Sn solders.
However, your predictions will not be based on the microscopic model, but
rather on analytical ones, which were sort of "adjusted" to the collected data
(from lab experiments and from the field).
Quote of the month:
"I often say that when you can measure what you are speaking about, and
express it in numbers, you know something about it; but when you cannot measure
it, when you cannot express it in numbers, your knowledge is of a meagre and
unsatisfactory kind" Lord Kelvin
_______________________________________________
Jean-Paul Clech
EPSI Inc., P.O. Box 1522, Montclair, NJ 07042, USA
tel.:+1 (973)746-3796, fax: +1 (973)655-0815
_http://www.jpclech.com_ (http://www.jpclech.com/)
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