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July 2008

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sun, 20 Jul 2008 15:06:26 EDT
Content-Type:
text/plain
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text/plain (41 lines)
Hi Keith,
I certainly, would not subscribe to the "the sky is falling" view on Pb-free—
more the "the money is disappearing" view, as far as solder joints are 
concerned, but it is much worse for PCBs and components——and so totally unnecessary, 
actually damaging to the environment.
While tin pest is an actuality, from the anectotal reason of the defeat of 
Napoleon's army because their trousers dropped with powderized uniform buttons, 
to the multi-million Euro air conditiong reqired for the Viennese 
Kapuzinergruft to preserve the royal tin sarcophagi, I do not see any real threat for 
electronics.
The proper, perhaps improper, environments do not typically exist, and 100 
ppm Pb would even solve that reote eventuality.

Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 21/22, Hamburg, Germany
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



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